Item | Mass processing capability | Small batch processing capability |
Layer (Max.) | 2-22 | 24-28 |
Type of the board material | FR-4, high-TG , aluminum?base, Rogers, etc., F4, BT | PTFE,PPO ,PPE , |
Rogers,etc | E-65,ect |
Compound pressed board | 4 layers 6 layers | 6 layers 8 layers(FR-4+Rogers) |
Maximum Size | 400mm X 700mm | 500mm X 1000mm?? |
Outline Size Tolerance | ±0.13mm | ±0.10mm |
V-CUT Deepness Tolerance | +/- 0.15 mm (V-CUT) :+/- 0.1 mm (CNC V-CUT) |
BoardThicknessRange | 0.1mm--6.0mm | 7.0--8.0mm |
Board Thickness Tolerance( t≥0.8mm) | ±8% | ±5% |
Board Thickness Tolerance (t<0.8mm) | ±10% | ±8% |
Medium Thickness(Min) | 0.065mm(RCC) | 0.05mm |
Minimum Line Width | 0.075mm(3mil) | 0.063mm(2.5mil) |
Minimum Line Distance | 0.075mm(3mil) | 0.063mm(2.5mil) |
Line Margin | 0.2 mm(CNC) :0.30 mm (punch):0.50 mm (V-CUT) |
Outer layer copper thickness | 9um--140um | 175um--210um |
Inner layer copper thickness | 9um--140um | 175um--210um |
Drill hole size (mechanical hole) | 0.25mm--6.00mm | 0.15mm--0.25mm |
Finish Hole size (mechanical hole) | 0.10mm--6.00mm | 0.05mm--0.1mm |
Hole size tolerance (mechanical hole) | +/- 0.076 mm (normal hole) +/- 0.05 mm (fit-press hole) +0.1/-0.05 mm (punch hole) |
Hole position deviation (mechanical hole) | +/-0.075mm: (drill hole) : +/- 0.10 mm (punch hole) | 0.050mm |
Laser hole size | 0.10mm (1+n+1;2+n+2) | 0.075mm |
Aspect Ratio | 10:1 (drill hole size>0.2mm) | 12:1(drill hole size>0.25mm) |
Solder mask type | sensitive green, yellow, black, MATT, blue, red ink,and peelable blue glue. |
Minimum width of solder mask bridge | 0.10mm | 0.075mm |
Minimum size of solder mask separation ring | 0.05mm | 0.025mm |
Soldermask oil? plug hole diameter | 0.25mm--0.60mm | 0.6mm-0.70mm |
Impedance tolerance | ±10% (impedance>50ohm);±5ohm(impedance<50ohm) | ±5% (impedance>50ohm) |
Surface processing type | HAL, plating nickel gold(soft gold/flash gold), thick & hard gold, chemical nickel gold,immersion tin,lead-free H.A.S.L, Entek,gold-finger,and selective surface processing. |